International Engagement Project Under the CHIPS Act/International Technology Security and Innovation Fund
The State Department is directing funds from the International Technology Security and Innovation (ITSI) Fund to help create diverse, resilient, secure, and more transparent semiconductor supply chains. As part of these efforts, the ITSI Funds will support projects in 2023 and 2024 at the Organisation for Economic Co-operation and Development (OECD) through the Committee on Industry, Innovation and Entrepreneurship (CIIE) and the Committee on Digital Economy Policy (CDEP)
The U.S. contribution will support the OECD’s work on semiconductors, including the following:
- Build a semiconductor exchange network of officials involved in semiconductor industry policymaking where participants exchange information on the current state of the semiconductor ecosystem and recent public and private initiatives in their respective countries.
- Create a government-to-government repository of information on active and planned semiconductor production facilities in participating countries.
- Catalogue public support initiatives relevant for the semiconductor ecosystem.
- Produce an overview of regulatory best practices and factors that make for successful semiconductor ecosystems.
- Develop new approaches to anticipate semiconductor supply gluts, shortages and disruptions, and related management issues.
Recognizing the interdependence of the global semiconductor ecosystem, the United States will continue to work with partners and allies to expand the global semiconductor supply chain. The United States will continue to be transparent with partners and will work to develop strategies collaboratively. This communal effort, in turn, will make global semiconductor supply chains more resilient.
For further information, please contact [email protected] or visit the ITSI website: https://www.state.gov/the-u-s-department-of-state-international-technology-security-and-innovation-fund.
Official news published at https://www.state.gov/international-engagement-project-under-the-chips-act-international-technology-security-and-innovation-fund/
Politics - JISIP NEWS originally published at Politics - JISIP NEWS
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